基于不同封装胶膜的单玻TOPCon组件可靠性研究
吴韦, 吕琳, 张衍, 付呈刚, 邓鑫, 王婧婧, 洪玉丹, 安超
Reliability study of glass-backsheet TOPCon modules based on different encapsulation films
WU Wei, LV Lin, ZHANG Yan, FU Chenggang, DENG Xin, WANG Jingjing, HONG Yudan, AN Chao
电源技术
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2026, (1): 170
-178
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DOI: 10.3969/j.issn.1002-087X.2026.01.021
