Reliability study of glass-backsheet TOPCon modules based on different encapsulation films

WU Wei; LV Lin; ZHANG Yan; FU Chenggang; DENG Xin; WANG Jingjing; HONG Yudan; AN Chao

doi:10.3969/j.issn.1002-087X.2026.01.021

WU Wei, LV Lin, ZHANG Yan, FU Chenggang, DENG Xin, WANG Jingjing, HONG Yudan, AN Chao

Chinese Journal of Power Sources ›› 2026, Vol. 50 ›› Issue (1) : 170-178.

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Chinese Journal of Power Sources ›› 2026, Vol. 50 ›› Issue (1) : 170-178. DOI: 10.3969/j.issn.1002-087X.2026.01.021

Research and design: Physical power sources

Reliability study of glass-backsheet TOPCon modules based on different encapsulation films

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2026, 50(1): 170-178 https://doi.org/10.3969/j.issn.1002-087X.2026.01.021

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Received	Published
2025-08-21	2026-01-20
Issue Date
2026-01-26

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