WU Wei, LV Lin, ZHANG Yan, FU Chenggang, DENG Xin, WANG Jingjing, HONG Yudan, AN Chao
To address the reliability of N-type glass-backsheet TOPCon PV modules under high temperature and high humidity environments due to hydrolysis-induced corrosion of encapsulating adhesive film, this study systematically evaluated the physicochemical properties of EPE, EVA and acetate-modified adhesive film (peel strength, crosslinking, water vapor transmission rate, acid value) and combined them with the accelerated damp-heat (DH) and potentiostatic-induced degradation (PID) tests of the modules, the study investigated the impact of encapsulation adhesive films on module performance. The results showed that DH test significantly increased the water vapor transmission rate and acid value of the film, and exacerbated the decrease of peel strength and cross-linking degree of the film. Under the same type of film, the acetate-resistant adhesive film showed less degradation of various properties, and it was found that moisture was a necessary condition for inducing corrosion. The key findings are: double-sided acetic acid-resistant adhesive film package can effectively inhibit acetic acid-moisture synergistic corrosion, after 2000 h of DH testing, the power degradation of the corresponding module is only 3.79%, much lower than the double EVA package module 12.75%, and the gate line corrosion is significantly reduced, the three rounds of PID test attenuation as low as 1.57%. This provides an effective strategy to enhance the wet-heat reliability of TOPCon modules by optimizing the encapsulation material.