Investigations on damp heat resistance of glass-backsheeet TOPCon modules

WU Wei; ZHANG Yan; LV Lin; FU Chenggang; DENG Xin; WANG Jingjing; HONG Yudan; AN Chao

doi:10.3969/j.issn.1002-087X.2026.06.022

WU Wei, ZHANG Yan, LV Lin, FU Chenggang, DENG Xin, WANG Jingjing, HONG Yudan, AN Chao

Chinese Journal of Power Sources ›› 2026, Vol. 50 ›› Issue (6) : 1185-1191.

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Chinese Journal of Power Sources ›› 2026, Vol. 50 ›› Issue (6) : 1185-1191. DOI: 10.3969/j.issn.1002-087X.2026.06.022

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Investigations on damp heat resistance of glass-backsheeet TOPCon modules

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2026, 50(6): 1185-1191 https://doi.org/10.3969/j.issn.1002-087X.2026.06.022

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Received	Published
2026-03-05	2026-06-20
Issue Date
2026-06-22

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